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Standard [CURRENT]

DIN EN 62047-22:2015-04

Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 62047-22:2014); German version EN 62047-22:2014

German title
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 22: Elektromechanisches Zug-Prüfverfahren für leitfähige Dünnschichten auf flexiblen Substraten (IEC 62047-22:2014); Deutsche Fassung EN 62047-22:2014
Publication date
2015-04
Original language
German
Pages
11

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Publication date
2015-04
Original language
German
Pages
11
DOI
https://dx.doi.org/10.31030/2286711

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ICS
31.080.01, 31.220.01
DOI
https://dx.doi.org/10.31030/2286711

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