Standard [WITHDRAWN]
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This part of IEC 61760 contains a series of requirements, process conditions and corresponding test conditions which shall be applied during the compilation of the specification of electronic components that are intended for usage in through hole reflow (THR) soldering technology. The purpose of this standard is to ensure that components intended for through hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto this standard specifies tests and requirements that need to be part of general, sectional or detail specification, when through hole reflow soldering is intended to be used. Furthermore, this standard provides component users and manufacturers with a reference set of typical process conditions used in through hole soldering technology. The responsible Committee is K 682 "Montageverfahren für elektronische Baugruppen" ("Electronics assembly technology") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.
This document has been replaced by: DIN EN IEC 61760-3:2022-07 .
Cooperation at DIN