Standard
[CURRENT]
BS IEC 62047-31:2019-04-17
Semiconductor devices. Micro-electromechanical devices. Four-point bending test method for interfacial adhesion energy of layered MEMS materials
- Publication date
-
2019-04-17
- Original language
-
English
- Pages
- 16
- Publication date
-
2019-04-17
- Original language
-
English
- Pages
- 16
Product information on this site:
Quick delivery via download or delivery service
Buy securely with a credit card or pay upon receipt of invoice
All transactions are encrypted
Loading recommended items...
Loading recommended items...
Loading recommended items...
Loading recommended items...