Device embedding assembly technology. Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
German title
Montageverfahren für eingebettete Bauteile Leitfaden für gestapelte Elektronikmodule. Verfahren zur Beurteilung der elektrischen Verbindungsfähigkeit zwischen den Modulen
Publication date
2021-08-20
Original language
English
Pages
18
Publication date
2021-08-20
Original language
English
Pages
18
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