Test methods for electrical materials, printed board and other interconnection structures and assemblies. Thermal resistance of an assembly by thermal transient method
German title
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen Thermischer Widerstand der dielektrischen Schicht durch thermische transiente Methode
Publication date
2024-06-04
Original language
English
Pages
26
Publication date
2024-06-04
Original language
English
Pages
26
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