Standard
[CURRENT]
BS EN IEC 60749-15:2020-10-01
Semiconductor devices. Mechanical and climatic test methods. Resistance to soldering temperature for through-hole mounted devices
- German title
- Halbleiterbauelemente. Mechanische und klimatische Prüfverfahren Beständigkeit gegen Löttemperatur bei Bauelementen zur Durchsteckmontage
- Publication date
-
2020-10-01
- Original language
-
English
- Pages
- 16
- Publication date
-
2020-10-01
- Original language
-
English
- Pages
- 16
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