Semiconductor devices. Micro-electromechanical devices. Test methods for determining residual stresses of MEMS films Wafer curvature and cantilever beam deflection methods
German title
Halbleiterbauelemente. Bauelemente der Mikrosystemtechnik. Messverfahren zur Ermittlung der Eigenspannungen in Dünnschichten von MEMSBauteilen. Substratkrümmungs- und Biegebalken-Verfahren
Publication date
2015-07-31
Original language
English
Pages
18
Publication date
2015-07-31
Original language
English
Pages
18
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