Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
German title
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen. Prüfverfahren für Verbindungsstrukturen (Leiterplatten). Überwachung des Widerstands von Einzeldurchkontaktierungen (PTH - plated-through hole) bei Temperaturwechselbeanspruchung
Publication date
2016-04-30
Original language
English
Pages
18
Publication date
2016-04-30
Original language
English
Pages
18
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