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Standards Worldwide
Standards Worldwide
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Standard [CURRENT]

BS EN 60191-6-4:2003-08-04

Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

German title
Mechanische Normung von Halbleiterbauelementen - Allgemeine Regeln fuer die Erstellung von Gehaeusezeichnungen von SMD-Halbleitergehaeusen - Messverfahren fuer Gehaeusemasse von Ball Grid Array (BGA)
Publication date
2003-08-04
Original language
English
Pages
20

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Publication date
2003-08-04
Original language
English
Pages
20

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