Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
German title
Mechanische Normung von Halbleiterbauelemente - Allgemeine Regeln fuer die Erstellung von Gehaeusezeichnungen von SMD-Halbleitegehaeusen - Messverfahren fuer QFP-Gehaeusemasse
Publication date
2001-05-15
Original language
English
Pages
20
Publication date
2001-05-15
Original language
English
Pages
20
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