Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
German title
Mechanische Normung von Halbleiterbauelementen. Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen. Messverfahren für Gehäusemaße von kleinen Gehäusen (SOP)
Publication date
2010-12-31
Original language
English
Pages
18
Publication date
2010-12-31
Original language
English
Pages
18
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