Draft standard
OVE EN IEC 63378-3:2024-06-01 - Draft
Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis (IEC 47D/967/CDV) (english version)
- Publication date
-
2024-06-01
- Original language
-
English
- Pages
- 18
- Publication date
-
2024-06-01
- Original language
-
English
- Pages
- 18
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