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Standards Worldwide
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Draft standard

OVE EN IEC 60749-20-1:2023-11-01 - Draft

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 47/2565/FDIS) (english version)

German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20-1: Handhabung, Verpackung, Kennzeichnung und Transport oberflächenmontierbarer Bauelemente, die empfindlich gegen die Kombination von Feuchte und Lötwärme sind (IEC 47/2565/FDIS) (englische Fassung)
Publication date
2023-11-01
Original language
English
Pages
6

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Publication date
2023-11-01
Original language
English
Pages
6

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