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Draft standard [WITHDRAWN]

DIN EN IEC 63287-2:2022-06 - Draft

Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of mission profile (IEC 47/2718/CDV:2021); German and English version prEN IEC 63287-2:2021

German title
Halbleiterbauelemente - Richtlinien für Zuverlässigkeitsqualifizierungspläne - Teil 2: Konzept des Einsatzprofils (IEC 47/2718/CDV:2021); Deutsche und Englische Fassung prEN IEC 63287-2:2021
Date of issue
2022-05-06
Publication date
2022-06
Original language
German, English
Pages
29

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Date of issue
2022-05-06
Publication date
2022-06
Original language
German, English
Pages
29
DOI
https://dx.doi.org/10.31030/3346408

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ICS
31.080.01
DOI
https://dx.doi.org/10.31030/3346408
Replacement amendments

This document has been replaced by: DIN EN IEC 63287-2:2024-10 .

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